Module PACK Line

In the module PACK line body, the cell is first on-line, and the open voltage (OCV) is identified by scanning code to ensure the quality of each cell. For cells that are detected as unqualified (NG), fill up quickly. Next, adjust the polarity to ensure proper connection. Plasma cleaning technology is used to remove surface impurities and improve the bonding strength of subsequent adhesives. The automatic equipment completes the operation of gluing and tearing film, and detects the quality of the glue layer in real time to ensure uniform and no bubbles. After the cells are stacked, the end plates are fitted with foam to reduce vibration and noise. Finally, laser welding technology is used to ensure that the connection points are strong, and the module is smoothly off the line, ready for subsequent quality testing and packaging.

Underlying Parameter

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